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Where Semiconductor Design Meets Packaging & Systems

IEEE-IDSPS 2026 India's Global Semiconductors to Systems Conference Converging Innovation in Semiconductors, Packaging & Systems Across 9 Key Futuristic Technologies

Event Date December 6-9, 2026
Venue Novotel, Visakhapatnam
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500+
Delegates
50+
Speakers
100+
Companies
package Package design & Architectures reliability Design for Reliability glass Glass Substrates with TGV rdl RDL opto Int. Opto-electronics bonding Hybrid bonding power-integrated Int. power electronics power-components Power Components thermal Thermal package Package Design & Architectures reliability Design for Reliability glass Glass Substrates with TGV rdl RDL opto Int. Opto-electronics bonding Hybrid bonding power-integrated Int. power electronics power-components Power Components thermal Thermal
About the Conference

Shaping the Future of Semiconductors

IEEE-IDSPS 2026 – The International Conference on Design & Semiconductors to Packaging & Systems is a premier global platform bringing together leaders from academia, industry, research institutions, startups, and policy ecosystems to advance the semiconductor value chain.

Scheduled in Visakhapatnam, India, IEEE-IDSPS 2026 aims to position India firmly on the global semiconductor map by fostering collaboration across the ecosystem — from chip design and fabrication to packaging and system integration — and standing alongside leading semiconductor conferences across the USA, Europe, China, Japan, and Singapore as India's flagship forum for innovation and system-level excellence.

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PDC Courses

Expert-led Professional Development Courses offering focused learning on advanced semiconductor technologies.

Technical Keynotes

Keynote talks from global industry leaders and researchers shaping the semiconductor ecosystem.

Expert Panels

Panel discussions with industry and academic experts on emerging trends and challenges.

Industry Case Studies

Real-world case studies highlighting practical innovations and applications in semiconductor technologies.

Innovation Showcase

Exhibition space for companies and startups to present cutting-edge technologies and solutions.

Suppliers Sessions

Industry suppliers presenting the latest tools, materials, and manufacturing technologies.

Industry–Academia Collaboration

Encouraging partnerships between industry and research institutions.

Networking Opportunities

Connect with global experts, researchers, industry leaders, and innovators.

Global Participation

Experts and organizations from leading semiconductor ecosystems worldwide.

IDSPS Program Network

9 Industry Co-Development Centers and Two Pilot Line Hubs In The IDSPS Program

Advanced Packaging Hub @ IITGN Int. Power Electronics Hub @ IITBBS
Center
Industry Co-Development Centers 9
Pilot Line Hubs 2

Pilot Line Hubs

Advanced Packaging Hub

IIT Gandhinagar, Gujarat

Integrated Power Electronics Hub

IIT Bhubaneswar, Odisha

Program Centers

Package Design & Architectures

IIT Ropar (IIT RPR), Punjab

Design for Mechanical Reliability

BITS Pilani, Rajasthan

IC & Board Assembly

IIT Kanpur (IIT K), Uttar Pradesh

Power Module Design

IIT Bombay (IIT B), Maharashtra

Interconnecting Substrates

IIT Bombay (IIT B), Maharashtra

Thermal Technologies

IIT Kharagpur (IIT KGP), West Bengal

Integrated Opto-Electronics

IIT Hyderabad (IIT H), Telangana

Substrate, Module & System Level Test

IIT Tirupati (IIT TP), Andhra Pradesh

Materials for Components & Packaging

IISc Bangalore & NIT Calicut

Featured Speakers

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Event Sponsors

Strategic Partners

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Venue Location

Novotel, Visakhapatnam, Andhra Pradesh - 530003

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[email protected]

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+91 891 XXX XXXX
+91 90008 23366
Mon-Fri: 9AM - 6PM IST

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