India's premier global semiconductor conference — from chip design to packaging, systems integration, and beyond.
IEEE-IDSPS 2026 – The International Conference on Design & Semiconductors to Packaging & Systems is a premier global platform bringing together leaders from academia, industry, research institutions, startups, and policy ecosystems to advance the semiconductor value chain.
Scheduled in Visakhapatnam, India, IEEE-IDSPS 2026 aims to position India firmly on the global semiconductor map by fostering collaboration across the ecosystem — from chip design and fabrication to packaging and system integration — and standing alongside leading semiconductor conferences across the USA, Europe, China, Japan, and Singapore as India's flagship forum for innovation and system-level excellence.
Expert-led Professional Development Courses offering focused learning on advanced semiconductor technologies.
Keynote talks from global industry leaders and researchers shaping the semiconductor ecosystem.
Panel discussions with industry and academic experts on emerging trends and challenges.
Real-world case studies highlighting practical innovations and applications in semiconductor technologies.
Exhibition space for companies and startups to present cutting-edge technologies and solutions.
Industry suppliers presenting the latest tools, materials, and manufacturing technologies.
Encouraging partnerships between industry and research institutions.
Connect with global experts, researchers, industry leaders, and innovators.
Experts and organizations from leading semiconductor ecosystems worldwide.
Prof. Rao Tummala is the General Chair and Organizer, supported by four global professional societies — IEEE, IMAPS, GEA, SMTA, 10 IITs/IISc, and a minimum of 30 global companies. Prof. Rao Tummala has organized dozens of conferences in the USA and two in India: ISPEC-1 at Chandigarh and ISPEC-2 in Gujarat (https://ispec.co.in/).
The IDSPS program is an India-wide, large scale, global-level R&D, workforce and global supply-chain program involving the top 50 research academic institutions and about 50 global companies, initially, all working together to set up 10 national industry co-development technology centers throughout India in Advanced Packaging at IITGN and Integrated power electronics at IITBBS that integrates all these technology advances by means of a pilot line into industry prototypes, in partnership with global companies to close the above gaps, particularly the manufacturing and workforce gap between India vs. Advanced countries.
Drives global semiconductor innovation through standards, research leadership, and worldwide technical communities.
Accelerates advanced packaging and microelectronics innovation by connecting global industry and academia.
Unites global electronics leaders from semiconductors to systems to advance next-generation technologies, guidelines, and education.
Advances electronics manufacturing by connecting professionals through education, technical resources, and networking.
IDSPS partnering academic institutions include IIT Tirupati, IISc Bangalore, IIT Gandhinagar, IIT Bhubaneswar, IIT Ropar, BITS Pilani, IIT Kanpur, IIT Kharagpur, IIT Bombay, and IIT Hyderabad. In addition, 50–100 colleges and universities across India and ten or more from the USA, Europe, Japan, and Taiwan are expected to participate.
The conference plans to include all 32 IDSPS Industry Consortium partners, including Intel, Infineon, CDIL, Tessolve, Baba Fine Chemicals, Evatec AG, Resonac, Qualcomm, GlobalFoundries, Ansys, Micron Technology, Lam Research, Texas Instruments, STMicroelectronics, Marvell Technology, NXP Semiconductors, Tata Electronics, Applied Materials, and others. An additional 50–100 companies from India and abroad will be invited.