IEEE-IDSPS 2026 · Technical Paper Presentation

Share Your Research.
Win Recognition.

IDSPS invites researchers, scholars, and industry professionals to submit original technical papers. Selected authors present at the conference, compete for awards, and publish in IEEE Xplore.

Submit Your Paper
Current Status
Stage 1: Open for Title Submissions
We are currently collecting paper titles and author details. Early submissions are reviewed on a rolling basis.
Deadline: 1st April — Early bird encouraged
How It Works

Three Stages to Recognition

A clear, structured pathway from your initial title submission through to award presentation on conference day.

1
Now Open

Paper Title Submission

Submit your paper title, author details, and research domain. Our committee reviews all titles for scope and relevance.

Rolling review basis
2
Upcoming

Summary Submission

Shortlisted authors submit a structured abstract or extended summary for deeper evaluation by the programme committee.

Invite-only · 500–800 words
3
Upcoming

Awards & Presentation

Finalists present at the conference. Outstanding papers receive Best Paper, Runner-Up, and Merit awards with certificates.

At-conference presentation
Mark Your Calendar

Important Dates

All deadlines are at 23:59 IST (UTC+5:30). Extensions, if any, will be announced on the official website.

Paper Submission
1st April , 2026
Full papers accepted from this date
Abstract Submission
1st July, 2026
Hard deadline — no extensions
Conference Dates
Dec 6–9, 2026
Novotel, Visakhapatnam
Before You Submit

Submission Guidelines

Please review the following requirements before submitting your paper title to ensure eligibility and a smooth review process.

  • Original, unpublished research not under review elsewhere
  • Paper title must be descriptive — 10 to 20 words recommended
  • Co-authors (up to 4) must be listed at submission stage
  • Papers must align with one of the listed conference topics
  • Stage 2 summaries: 500–800 words, IEEE format preferred
  • Use the official IEEE conference two-column template (6–8 pages)
  • All submissions undergo double-blind peer review
  • Accepted authors must register for the conference to present
  • Accepted papers will be published in IEEE Xplore
Conference Topics
Package Design & Architectures
Package Design – Mechanical
Materials Comp. & Packaging
Power Electronics
Interconnecting Substrates
Integrated Opto-Electronics
IC & Board Assembly
Thermal Technologies
System Level Electrical Test
Submit Your Work

Paper Title Submission

Fill in the form below. Shortlisted authors will be contacted within 5–7 working days to proceed to Stage 2.

Stage 1 — Now Open

Submit Your Paper Title

Fields marked * are required. All submissions are reviewed on a rolling basis.

Paper Title Submission
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Submission Received!

Thank you for submitting your paper title to IDSPS. Our review committee will assess your submission and respond within 5–7 working days. Shortlisted authors will be invited to Stage 2.